Method of forming blister pack packaging
US5840243A · kind A · utility
3Cited by
27References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1996 |
| Grant date | Nov 24, 1998 |
| Priority date | — |
| Expiry date | Jun 17, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/722
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of forming blister pack packaging is provided including providing a thermoplastic material and placing the thermoplastic material between a pair of opposed male and female thermoforming dies, while cooling a portion of at least one of the dies. The cooled portion of the die is positioned to contact the area of the thermoplastic material in which it is desired to avoid distortion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.