Process for throughplating printed circuit boards using conductive plastics
US5840363A · kind A · utility
4Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 1997 |
| Grant date | Nov 24, 1998 |
| Priority date | — |
| Expiry date | Mar 28, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0783
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention pertains to a process for throughplating of printed circuit boards using conductive plastics for direct plating, wherein a polymer film with intrinsic electric conductivity is adhesively deposited on non-conductive areas of the printed circuit boards, whereupon a metal film is applied. Selective production of the polymer film has previously been seen as requiring an oxidative pre-treatment of the printed circuit board, though this can negatively affect the further course of the process. With the present invention the potential negative effects are avoided by forgoing the oxidation pre-treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.