Housing for electronic apparatus and method of damping unwanted radiation of electromagnetic waves
US5841067A · kind A · utility
20Cited by
1References
6Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 11, 1996 |
| Grant date | Nov 24, 1998 |
| Priority date | — |
| Expiry date | Jun 11, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0045
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A housing for electronic apparatus which is effectively protected against electromagnetic wave leakage, the housing being equipped or lined, in an area of the conductive layer-carrying inside surface of the housing, the area adjoining, or is in the vicinity of, an opening of the housing, with a sheet molded, to a thickness of 70 to 300 .mu.m, from a magnetic material-containing resin composition comprising 7 to 60% by weight of a binder resin (a) and 40 to 93% by weight of a finely divided magnetic material (b) having a magnetic loss term, and a method of damping unwanted radiation of electromagnetic waves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.