Laser machining apparatus and method of controlling same
US5841096A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 1997 |
| Grant date | Nov 24, 1998 |
| Priority date | — |
| Expiry date | Sep 12, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/104
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser machining apparatus according to the present invention describes characteristics of a laser oscillator with a function including laser power, pulse frequency and duty ratio, computes a command for a power supply unit in a feed forward control section according to a command based on the function and on the power, duty ratio and frequency, computes a command for a power supply unit in the feedback control section from a power command value and a power measurement value from the power sensor, and inputs these command to the power supply unit. Also the laser machining apparatus detects changes in characteristics in the laser oscillator and corrects the function for characteristics of the laser oscillator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.