Manufacture of ink jet printheads
US5842258A · kind A · utility
19Cited by
7References
60Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 1996 |
| Grant date | Dec 1, 1998 |
| Priority date | — |
| Expiry date | Sep 3, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1064
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Ink jet printhead components are formed initially by bonding together a grooved base wafer and a suitable cover wafer, the area of the bonding wafer assembly being sufficient to provide a 14.times.14 array of components. Using a datum formation, the wafer assembly is divided into strips and linear processing steps are conducted, such as applying nozzle plates and laser ablating nozzles. Each strip can then be divided to form separate printhead components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.