Method of forming discrete solder portions on respective contact pads of a printed circuit board
US5842274A · kind A · utility
8Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 5, 1995 |
| Grant date | Dec 1, 1998 |
| Priority date | — |
| Expiry date | Sep 5, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides for a method of forming discrete solder portions (16) on respective contact pads (10) whereby a strip of solder paste (12) is formed over a plurality of said pads (10). The strip (12) is formed with portions of reduced width (14) which are located over the spaces (22) between adjacent pads (10). The paste is melted and the surface tension at the portions of reduced width (14) causes the movement of solder towards the pads (10) and the separation of the strip (12) into discrete solder portions (16).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.