Perforated substrate and method of manufacture
US5842398A · kind A · utility
2Cited by
18References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 1996 |
| Grant date | Dec 1, 1998 |
| Priority date | — |
| Expiry date | Sep 13, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/943
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A perforated substrate having half of the perforations formed from one major surface of the substrate and the other half formed from the opposite major surface, the two major surface being coplanar is described. This introduces equal and opposite stress forces into the substrate which essentially cancel each other and provide a product meeting exacting planarity requirements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.