Semiconductor wafer anchoring device
US5842690A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 1996 |
| Grant date | Dec 1, 1998 |
| Priority date | — |
| Expiry date | Dec 13, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB25B5/163
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semiconductor wafer anchoring device, which includes a platen having a flat upper surface adapted for mounting a semiconductor wafer thereon, an elastic O-ring located between the platen and the semiconductor wafer, and a clamp disposed to face with the O-ring, which is adapted for pressing upon the upper surface of the semiconductor wafer and for anchoring same. The clamp is a ring-type plate having an inner diameter larger than the diameter of the semiconductor wafer, and having a plurality of protrusions projecting from each quadrant of an inner circumferential surface of the ring-type plate toward the center thereof, an end of each protrusion being adapted to be positioned between a chip pattern and the edge of the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.