Measuring deposit thickness in composite materials production
US5843232A · kind A · utility
8Cited by
8References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 1995 |
| Grant date | Dec 1, 1998 |
| Priority date | — |
| Expiry date | Nov 2, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/0683
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
This invention relates to novel apparatuses for measuring deposit thickness during composite materials production. More particularly, this invention uses a composite's emission signature or a composite's reflectance signature, to measure deposit thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.