Process for connecting circuits and adhesive film used therefor
US5843251A · kind A · utility
66Cited by
12References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1992 |
| Grant date | Dec 1, 1998 |
| Priority date | — |
| Expiry date | Mar 20, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1075
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.