Slurry dispensing system for chemical-mechanical polishing apparatus
US5843269A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 1997 |
| Grant date | Dec 1, 1998 |
| Priority date | — |
| Expiry date | Apr 18, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Chemical-mechanical polishing apparatus includes three subassemblies, a top subassembly which is non-rotating but which has a lower section which forms a shell about a center and a lower subassembly both of which rotate within the shell. The system also includes a slurry dispensing system which is embedded in the shell and which is operative to supply slurry just in front of the advancing edge of a wafer being polished by the system. The slurry dispensing system includes a tube with holes arranged 180 degrees about the shell of the non-rotating subassembly which is also operative to retain the wafer in contact with the (rotating) pad covered platen with which it is in contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.