Adhesive tape for tape automated bonding
US5843550A · kind A · utility
5Cited by
8References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 1996 |
| Grant date | Dec 1, 1998 |
| Priority date | — |
| Expiry date | Mar 7, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31725
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An adhesive tape for TAB having an organic insulating film, an adhesive layer formed on the organic insulating film and a protection layer formed on the adhesive layer, the adhesive layer being any one of a layer containing a polyamide resin having an amine value of at least 3 and an epoxy resin, a layer containing a polyamide resin and a powdery inorganic filler, a layer containing an epoxy resin having a siloxane structure in its main chain, and a layer containing at least one maleimide compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.