Method of dispersing silicone compositions in organic thermoplastic materials
US5844031A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 1996 |
| Grant date | Dec 1, 1998 |
| Priority date | — |
| Expiry date | Aug 28, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/80
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A method of dispersing silicone compositions in organic thermoplastic materials is disclosed. The novel compositions produced by the method of the invention have a fine and relatively uniform dispersion or organosilicone in an organic thermoplastic. An organosilicone resin (A) and a predominantly linear silicone fluid (B) are first blended to substantial homogeneity to form an organosilicone alloy therefrom. The organosilicone alloy exhibits thermoplastic behavior and has a temperature-dependent complex viscosity .eta.*.sub.Si (T) associated therewith. Likewise the organic thermoplastic materials have a temperature-dependent complex viscosity, .eta.*.sub.OTP (T), associated therewith. The organic thermoplastic and the organosilicone alloy are thereafter mixed at a predetermined mixing temperature, T.sub.m, and a predetermined shear strain rate. The organic thermoplastic material and the organosilicone alloy are both in a flowable state at T.sub.m. The value of T.sub.m is selected to be about .+-.30.degree. C. of a temperature, T.sub.0, wherein the absolute value of {72*.sub.OTP (T.sub.0)-.eta.*.sub.Si (T.sub.0)} is at its lowest value, at the predetermined shear strain rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.