Method for drilling subminiature through holes in a sensor substrate with a laser
US5844200A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 1996 |
| Grant date | Dec 1, 1998 |
| Priority date | — |
| Expiry date | May 16, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/52
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention is a method for drilling a subminiature through hole through a substrate. The through holes of the present invention are preferably drilled through an alumina substrate which is essentially impervious to aqueous electrolytes and blood over long periods of storage in potentially reactive environments. The holes are drilled by directing a sealed type CO.sub.2 laser at a predetermined position located on the substrate, energizing the laser at a power of approximately 75 to 225 watts, such that the laser beam focuses on the substrate at the predetermined position, and treating the substrate after the laser has drilled the hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.