Appratus for liquid thermosetting resin molding using radiofrequency wave heating
US5844217A · kind A · utility
15Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 1997 |
| Grant date | Dec 1, 1998 |
| Priority date | — |
| Expiry date | Sep 25, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/0058
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for liquid thermoset resin or polymer molding using electromagnetic waves (particularly radiofrequency waves or microwaves), is described. The method and apparatus uses a metal mold (10, 212) with a cavity (401) for the molding as well as for confinement of the electromagnetic waves. Multiple low loss ports (A, B, C, D, E, p1, p2, p3) are provided for introducing the microwaves into the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.