Integrated circuit anti-bridging leads design
US5844308A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 1997 |
| Grant date | Dec 1, 1998 |
| Priority date | — |
| Expiry date | Aug 20, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An IC package design and method of making the package design that provides anti-bridging between metal leads. The anti-bridge IC package design extends bottom covercoat material out onto the leads a sufficient distance to prevent solder bridging that typically takes place in cup regions of gull wing shaped leads. A further feature of the invention is to provide a method of applying covercoat material to the IC and the leads in the same process step. A resilient material wheel and related manufacturing equipment is used to apply a single covercoat material, like epoxy, in a single step that serves as both the bottom covercoat and lead anti-bridge coat for the IC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.