Heat sink
US5844313A · kind A · utility
18Cited by
5References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 23, 1997 |
| Grant date | Dec 1, 1998 |
| Priority date | — |
| Expiry date | Jun 23, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink for semiconductor components has a fin base and a plurality of spaced fins that all have the same height. A side of the base facing the fins is configured convexly with respect to the side of the fin base facing the semiconductor component, so that when the heat sink is used as intended, the roots of its fins are arranged on a surface of constant temperature. This yields a finned heat sink that attains a heat flux density hitherto achievable only with evaporative or fluid coolers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.