Method and apparatus for dip solder processing
US5845839A · kind A · utility
1Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1996 |
| Grant date | Dec 8, 1998 |
| Priority date | — |
| Expiry date | Dec 19, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/0669
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A dip soldering process includes a reservoir of molten solder and a solder ladle for immersion therein to refresh the supply of ladled solder. The ladled solder is displaced by a displacement plunger to thereby overflow the ladle and carry with it surface contamination. Continued immersion of the plunger during the soldering operation of the workpiece accomplishes continual flow across the soldered workpiece thereby removing any contaminants which rise to the surface or are introduced by the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.