Patent · US Expired

Heat activation method of thermosensitive adhesive label and heat-activating apparatus for the same

US5846358A · kind A · utility

17Cited by
9References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 30, 1997
Grant dateDec 8, 1998
Priority date
Expiry dateJan 30, 2017

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/1339
  • WIPO fieldTextile and paper machines
  • WIPO sectorMechanical engineering

Abstract

A heat activation method for activating a thermosensitive adhesive label having a support and a thermosensitive adhesive layer which is formed on the support and is not adhesive at room temperature, so as to make the thermosensitive adhesive layer adhesive with the application of heat thereto, includes the step of bringing the thermosensitive adhesive layer into contact with a surface portion of a heating medium, at least the surface portion of the heating medium being made of a silicone resin and having a peel strength of 2 g/mm or less with respect to the thermosensitive adhesive layer. There is also disclosed a heat-activating apparatus for heat-activating the above-mentioned thermosensitive adhesive label.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.