Direct deposition of a gold layer
US5846615A · kind A · utility
32Cited by
11References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 1997 |
| Grant date | Dec 8, 1998 |
| Priority date | — |
| Expiry date | Feb 28, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for forming a layer of gold on a substrate, comprising: preparing a solution of a gold precursor wherein the gold precursor consists of EQU Au(OH).sub.p (OOCR.sup.1).sub.q (OOCR.sup.2).sub.r wherein R.sup.1 is selected from the group of hydrogen, alkyl, alkenyl, and alkynyl, and R.sup.2 is selected from the group of hydrogen, alkyl from 2 to 10 carbon atoms, alkenyl, or alkynyl, and p+q+r=3. Applying the solution of the gold precursor to the surface of the substrate. Decomposing the gold precursor by subjecting the gold precursor to heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.