Solderless wire splicing device and method
US5847320A · kind A · utility
Inventor
Key dates
| Filing date | Sep 30, 1997 |
| Grant date | Dec 8, 1998 |
| Priority date | — |
| Expiry date | Sep 30, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R4/22
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A solderless connecting and splicing device and method employs a wire nut with a conductive element inside a rigid insulator. The conductive element has a frusto-conical passage with a tapered internal thread. Instead of twisting conductors together and inserting them directly into the wire nut, this invention provides a tube assembly of a number of conductive tubular elements joined together in parallel. A conductor is inserted into each element and the assembly inserted into the wire nut. The nut is then twisted. As the assembly is drawn into the smaller end of the passage the tubular elements collapse and crimp against the conductors to form a low resistance splice.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.