Semiconductor device
US5847449A · kind A · utility
2Cited by
12References
2Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jul 21, 1997 |
| Grant date | Dec 8, 1998 |
| Priority date | — |
| Expiry date | Jul 21, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In order to reduce the chip size of a semiconductor device as well as to separate noises between at least two types of pads having different functions, at least one Vcc and at least one Vss are provided on opposite edges of a package (101) so that output pins or I/O pins are arranged therebetween and input pins are arranged outside the same. Non-connected excess pins (NC) are arranged on upper and lower boundaries, for omitting wires and reducing the chip size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.