Microwave circuit package
US5847453A · kind A · utility
125Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 1997 |
| Grant date | Dec 8, 1998 |
| Priority date | — |
| Expiry date | Mar 19, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microwave circuit package includes a metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits (MMICs) and a spacer, made of a dielectric material, separating the MMICs from each other, and the MMICs and spacer are sealed in the package. The provision of the spacer substantially reduces the volume of the interior space of the package. A dielectric substrate having generally the same height as substrates of the MMICs may also be mounted on the metallic base plate, and a strip conductor may be provided on the dielectric substrate so as to form a microstrip line thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.