Patent · US Expired

Thickness gauging of single-layer conductive materials with two-point non linear calibration algorithm

US5847562A · kind A · utility

14Cited by
1References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 8, 1997
Grant dateDec 8, 1998
Priority date
Expiry dateMay 8, 2017

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01B7/105
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A thickness gauging instrument uses a flux focusing eddy current probe and two-point nonlinear calibration algorithm. The instrument is small and portable due to the simple interpretation and operational characteristics of the probe. A nonlinear interpolation scheme incorporated into the instrument enables a user to make highly accurate thickness measurements over a fairly wide calibration range from a single side of nonferromagnetic conductive metals. The instrument is very easy to use and can be calibrated quickly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.