Membrane probing of circuits
US5847571A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 3, 1996 |
| Grant date | Dec 8, 1998 |
| Priority date | — |
| Expiry date | Jul 3, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0735
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
First and second bumps electrically connected at first and second positions along a conductive run borne by a flexible substrate are respectively oriented for contact with a pad of a die under test and a pad of a tester. A probe frame is bonded to the substrate between connector frames bonded at opposite ends of the substrate. Alternatively, a pair of bumps exposed on the same surface of a flexible substrate are electrically connected at different positions along a conductive run. One of the bumps is oriented for contact with a pad of a die under test, and the other is in contact with a pad on a surface of a printed circuit board directed away from the die. The pad of the printed circuit board is provided for electrical connection to a tester.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.