Electronic assembly with porous heat exchanger and orifice plate
US5847927A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 1997 |
| Grant date | Dec 8, 1998 |
| Priority date | — |
| Expiry date | Jan 27, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/907
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic substrate is formed of a porous planar heat exchanger and an orifice plate overlying and thermally contacting the heat exchanger. The orifice plate has a plurality of apertures therethrough. An electronic device is mounted to the orifice plate. A coolant such as air or other gas is forced through the heat exchanger and the apertures of the orifice plate to remove heat that is generated by the electronic device. Preferably, at least two of the assemblies formed of the substrate and the mounted electronic device are mounted in a facing relationship to form a multichip module. A housing is provided to support the assemblies and to channel the flow of coolant through the substrates. Electrical interconnection between the components is provided by a peripheral ring with electrically conducting paths therethrough, which ring extends between the facing substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.