Expansion-matched high-thermal-conductivity stress-relieved mounting modules
US5848083A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 1996 |
| Grant date | Dec 8, 1998 |
| Priority date | — |
| Expiry date | Oct 24, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1301
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A mounting module (submount) for a high-power heat-dissipating element comprises a mounting plate thermal-expansion-matched to the element, a high-thermal-conductivity bulk layer having stress-relief apertures, and an auxiliary plate bonded to the bulk layer opposite the mounting plate. The element is mounted on the mounting plate, while the bulk layer is attached to the mounting plate on the side opposite the element. The apertures accommodate the expansion of the bulk layer along a major dimension of the mounting plate. The apertures run transverse to the mounting plate, so as not to impede heat flow through the mounting plate. The apertures serve either as reservoirs for excess solder during module assembly, or as conduits for cooling fluid. The bulk layer comprises either stacked sheets having aperture sections defined prior to assembly, or blocks defining the apertures at the block interfaces. Suitable heat-dissipating elements include high-power, high-duty cycle diode lasers and laser arrays, FETs, MOPAs, thyristors, and other high-power electronic components. For a GaAs laser bar, the mounting plate can be a thin CuW or Cu/Mo plate, while the bulk layer may be made of Cu. Th…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.