Polycrystalline diamond cutting element
US5848657A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1996 |
| Grant date | Dec 15, 1998 |
| Priority date | — |
| Expiry date | Dec 27, 2016 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/5735
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
The present invention relates to a novel domed polycrystalline diamond cutting element wherein a hemispherical diamond layer is bonded to a tungsten carbide substrate, commonly referred to as a tungsten carbide stud. Broadly, the inventive cutting element includes a metal carbide stud having a proximal end adapted to be placed into a drill bit and a distal end portion. A layer of cutting polycrystalline abrasive material disposed over said distal end portion such that an annulus of metal carbide adjacent and above said drill bit is not covered by said abrasive material layer. The geometry of the diamond cutting element provides control of interfacial stresses and reduces fabrication costs. The diamond cutting element may contain a pattern of ridges or bumps integrally formed in the abrasive layer which ridges are designed to cause high localized stresses in the rock, thus starting a crack. By initiating cracks in localized areas, the crushing action could be performed with less force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.