Apparatus for solvent bonding non-porous materials to automatically create variable bond charteristics
US5848811A · kind A · utility
20Cited by
19References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 1, 1997 |
| Grant date | Dec 15, 1998 |
| Priority date | — |
| Expiry date | Aug 1, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/477
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An apparatus which creates a pre-engineered solvent bond is disclosed which acts to self-optimize the characteristics of the resultant solvent bond. These characteristics can thus be chosen by the part designer with confidence that inherent variations in the assembly process will not unduly impact the resultant bond. The design establishes a specific volume through integral tabs or removable shims within which solvent acts to precisely dissolve material so that the predetermined bond characteristics are automatically created without reliance upon assembler technique.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.