Cleaning process
US5849106A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 1993 |
| Grant date | Dec 15, 1998 |
| Priority date | — |
| Expiry date | May 26, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0783
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An industrial cleaning process in which a contaminant comprising soldering flux and/or adhesive tape residue is removed from a substrate contaminated therewith, for example, a printed circuit board contaminated with rosin flux, comprising: (A) contacting the substrate with a terpene-based cleaning composition which is substantially free of water-soluble organic material, for example, a surfactant, for a period of time sufficient to solubilize the contaminant; (B) removing the composition and solubilized contaminant from the substrate by contact with water having a temperature of about 70.degree. F. to about 140.degree. F. (but preferably lower) for a period of time of no longer than about 10 minutes to provide a substrate having a contamination rating of no greater than about 14 micrograms NaCl equivalent/square inch (MIL-P-28809A), and to thereby form a mixture comprising the composition, contaminant and water; and (C) separating the water from said mixture, the separated water being substantially free of water-soluble organic material and having a chemical oxygen demand of no greater than about 1,000 ppm. and also a cleaning process utilizing a cleaning composition comprising a m…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.