Patent · US Expired

Acid bath for copper plating and process with the use of this combination

US5849171A · kind A · utility

10Cited by

6References

30Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Wolfgang Dahms · Berlin, DE
Horst Westphal · Berlin, DE

Key dates

Filing date	Oct 4, 1996
Grant date	Dec 15, 1998
Priority date	—
Expiry date	Oct 4, 2016

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC25D3/38
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

An aqueous acid bath for galvanic precipitation of copper is disclosed. The copper plating composition comprises at least one polymer phenazonium compound and .beta.-naphtholalkoxylate. A method for using such a bath for deposition of copper coatings is also disclosed. The resultant copper coatings are smooth and bright with substantially no fine roughness or pitting.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.