Molecularly bonded inherently conductive polymers on substrates and shaped articles thereof
US5849415A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 1996 |
| Grant date | Dec 15, 1998 |
| Priority date | — |
| Expiry date | Jul 26, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31935
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Organic inherently conductive polymers, such as those based on polyaniline, polypyrrole and polythiophene, are formed in-situ onto polymeric surfaces that are chemically activated to bond ionically the conductive polymers to the substrates. The polymeric substrate is preferably a preshaped or preformed thermoplastic film, fabric, or tube, although other forms of thermoplastic and thermoset polymers can be used as the substrates for pretreatment using, most preferably, phosphonylation-based processes followed by exposure to an oxidatively polymerizable compound capable of forming an electrically conductive polymer. The resultant conductive surface imparts unique properties to the substrates and allows their use in antistatic clothing, surface conducting films for electronic components and the like, and electromagnetic interference shielding. In an alternative embodiment, metals such as gold or platinum are bonded to the chemically interactive surface of a preshaped thermoplastic or thermoset article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.