Method of manufacturing and assembling an integrated circuit card
US5850690A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 1996 |
| Grant date | Dec 22, 1998 |
| Priority date | — |
| Expiry date | Jul 8, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In a first step, electrical conductor tracks (15 to 20) are applied against the bottom and the walls of a cavity (5) for the integrated circuit (IC4) and connected to external contact pads (2) at the same side of the card. Said tracks lie alternately side-by-side at the bottom 7 of the cavity. In a second step, the IC (4) is glued with its surface which does not carry the contacts on said tracks on the bottom (7) of the cavity by means of a non-conducting glue. Then connections are realized by soldering of conductor wires (12) between contacts of the IC and ends of the tracks, and the cavity is filled with a protective resin. Application: Placement of an IC with inverted contacts in an electronic card support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.