Attachment apparatus and method for an implantable medical device
US5851221A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 1997 |
| Grant date | Dec 22, 1998 |
| Priority date | — |
| Expiry date | Aug 1, 2017 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61N1/37512
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An implantable medical device of the type formed of a hermetically sealed enclosure attached on a enclosure attachment surface thereof to a module attachment surface of a pre-formed header module is disclosed. The pre-formed header module is attached to the enclosure attachment surface through use of a retention structure extending away from the enclosure surface into proximity with a portion of the pre-formed header module when the enclosure and module attachment surfaces are aligned with respect to one another. The retention structure comprises a bendable member that is bent from an initial position allowing the pre-formed header module to be seated with respect to the hermetically sealed enclosure to a retention position making an attachment against a bend engaging portion of the pre-formed header module. The bendable member is the free end portion of an attachment tab having a tab base attached at a predetermined location of the hermetically sealed enclosure such that the upstanding attachment tab extends in a predetermined direction away from the enclosure surface and the free end of the attachment tab is bendable laterally with respect to the predetermined direction against t…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.