Gas injection system for semiconductor processing
US5851294A · kind A · utility
529Cited by
29References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 1997 |
| Grant date | Dec 22, 1998 |
| Priority date | — |
| Expiry date | Sep 12, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4558
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A system for injecting a gaseous substance into a semiconductor processing chamber. The injection system includes at least one plenum formed in a plenum body and a plurality of nozzles associated with each plenum for injecting gaseous substances from the plenums into the chamber. A conduit structure transports gaseous substances along an indirect path from the plenum to the nozzles. The nozzles are positioned and configured to provide a uniform distribution of gaseous substances across the wafer surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.