Method and apparatus for forming a laminate
US5851342A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1996 |
| Grant date | Dec 22, 1998 |
| Priority date | — |
| Expiry date | Nov 14, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2311/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus and a method for bonding a laminate formed of at least two layers of sheet material superimposed on one another with adhesive therebetween and moved along a path. The apparatus includes a first laminator having an upper plate assembly having a first low-friction laminate-contacting surface for contacting a first layer of the laminate, and an upper heat exchanger thermally coupled to the upper plate assembly. The first laminator also includes a lower plate assembly having a second low-friction laminate-contacting surface for contacting a second layer of the laminate, wherein the first and second laminate-contacting surfaces are disposed in opposed relationship for accommodating passage of the layers of the laminate therebetween, and a lower heat exchanger thermally coupled to the lower plate assembly. The first laminator further includes a drive member coupled to at least one of the laminate-contacting surfaces for varying the distance between the surfaces to apply pressure to the layers of the laminate. The apparatus may also include a second laminator downstream of the first laminator and substantially identical to the first laminator. The heat exchangers of the first…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.