Resin-molded product and method of manufacturing the same
US5851633A · kind A · utility
0Cited by
3References
16Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 16, 1996 |
| Grant date | Dec 22, 1998 |
| Priority date | — |
| Expiry date | May 16, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24496
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Packing is fixed to and adheres to a molded damper on the outer periphery of the both sides of the damper body like a frame. To prevent defective molded products, a portion of the damper body having the packing disposed thereon is made thicker than a portion without the packing so that resin can flow into the portion where the packing is disposed before it goes into the portion without the packing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.