Prepreg, process for producing the same and printed circuit substrate/board using the same
US5851646A · kind A · utility
32Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 1996 |
| Grant date | Dec 22, 1998 |
| Priority date | — |
| Expiry date | Oct 15, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2902
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a lightweight prepreg having uniform formation, low linear thermal expansion coefficient and good mechanical strength, comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or the thermosetting resin, a process for producing the same, and a printed circuit substrate/board using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.