Semiconductor wafer processing adhesives and tapes
US5851664A · kind A · utility
199Cited by
18References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 1997 |
| Grant date | Dec 22, 1998 |
| Priority date | — |
| Expiry date | Jun 3, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2883
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor wafer processing tape comprises a permanent backing and a layer of a non-pressure sensitive adhesive comprising a thermoplastic elastomer block copolymer on the permanent backing. Optionally, the adhesive may include an adhesion modifier such as a tackifying resin, a liquid rubber or a photocrosslinking agent. The tapes are useful for both wafer grinding and wafer dicing applications. A method of processing semiconductor wafers is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.