Wiring structure with metal wiring layers and polyimide layers, and fabrication process of multilayer wiring board
US5851681A · kind A · utility
6Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 1994 |
| Grant date | Dec 22, 1998 |
| Priority date | — |
| Expiry date | Mar 15, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention relates to a wiring structure having metal wiring layers and polyimide layers. An object of this invention is to overcome problems caused by oxidation of a metal surface, such as an increase in the resistance of wiring and a reduction in insulation, by preventing a reaction between a metal of the wiring layers, such as copper, and carboxyl groups of polyamic acid which make up the polyimide layers. In the wiring structure according to the present invention, the polyimide layers have been formed by heating and curing a resin composition which comprises a polyimide precursor, an amine compound and an organic solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.