Process for making hot melt adhesives using water soluble substituted lactam/polymer solutions as feedstocks
US5852083A · kind A · utility
3Cited by
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26Claims
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Key dates
| Filing date | May 29, 1997 |
| Grant date | Dec 22, 1998 |
| Priority date | — |
| Expiry date | May 29, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J7/10
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A process for making hot melt adhesive compositions comprising the steps of: PA1 (a) dissolving hot melt adhesive components into a room temperature or higher solution of a water soluble substituted (e.g. NMP) to form a water soluble substituted lactam (e.g. NMP)/hot melt adhesive component solution; PA1 (b) adding said solution formed in step (a) into water to form a solid; PA1 (c) extracting out the water soluble substituted lactam (e.g. NMP) from said solid formed in step (b); PA1 (d) drying of said solid wherein water soluble substituted lactam e.g. NMP, is leached out as in step (c) to form the hot melt adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.