Method and apparatus for supplying and placing components
US5852869A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1997 |
| Grant date | Dec 29, 1998 |
| Priority date | — |
| Expiry date | Mar 31, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for automatically supplying surface mount chip components from a bulk feeder and placing the chip components on a substrate. The apparatus includes a base frame, a substrate feeding mechanism, a placement head, and a placement head positioning system. The substrate feeding mechanism delivers substrates to a component receiving position on the base frame. The placement head is translationally movable with respect to the base frame and includes a component supplying and placing mechanism, to supply components and place components on a substrate in a desired location. The component supplying and placing mechanism includes a component transfer mechanism, a component feeder, and a vacuum spindle. The transfer mechanism includes a rotatable wheel with a plurality of component holding compartments, a plurality of angularly disposed stations, and a drive mechanism for sequentially moving the compartments to at least a component receiving station and a component delivery station. The feeder receives a plurality of components from a container and feeds the components in a desired orientation to the receiving station of the transfer mechanism. The vacuum spindle is disp…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.