Method for coining solder balls on an electrical circuit package
US5853517A · kind A · utility
8Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 1996 |
| Grant date | Dec 29, 1998 |
| Priority date | — |
| Expiry date | Nov 8, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are provided for coining solder balls on an organic electrical circuit package. Generally, this method includes placing a slug on one or more of the solder balls; and applying sufficient pressure for a sufficient period of time on the slug to flatten the surface of the solder balls so as to form planar solder coins. The apparatus includes a press; a ram attached to the press; a platform for receiving the package and a slug placed upon the solder balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.