Low friction, ductile, multilayer electrodeposits
US5853557A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 1997 |
| Grant date | Dec 29, 1998 |
| Priority date | — |
| Expiry date | Apr 4, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3473
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to composite articles including a surface layer of tin, lead, silver or an alloy thereof that contains co-deposited non-ionic polymeric particles to provide a reduced-friction deposit that has an initially low coefficient of friction and low insertion force and fretting corrosion in separable electronic connectors, and to methods for preparing the plated articles. The polymeric particles have a size between about 0.1 to 0.45 .mu.m in diameter to reduce the coefficient of friction of the resultant deposit to about 0.45 or below. Also, the deposit has excellent electrical properties and can be successfully soldered. The invention also relates to a solution for plating the surface layer of the composite articles, which surface layer reduces insertion force and fretting corrosion of separable electronic connectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.