Transient liquid phase sintering conductive adhesives
US5853622A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 1996 |
| Grant date | Dec 29, 1998 |
| Priority date | — |
| Expiry date | Aug 28, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0425
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An inventive method for electrical and thermal electronic component attachment is disclosed. The combination of transient liquid phase sintering (TLPS) and a permanent adhesive flux binder provides the advantages of both conventional soldering technology and conductive adhesives. This hybrid approach delivers electrical and thermal conduction through sintered metal joints and mechanical properties based on a tailorable polymer matrix. These transient liquid phase sintering conductive adhesives can utilize conventional dispensing, placement, and processing equipment. During the reflow process, metal powders in the composition undergo interparticle sintering as well as alloying to the contact pads. This process produces a strong mechanical, thermal, and electrical interconnect which ensures good conductivity that is also resistant to humidity and temperature cycling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.