Method for producing a micro optical semiconductor lens
US5853960A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 1998 |
| Grant date | Dec 29, 1998 |
| Priority date | — |
| Expiry date | Mar 18, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/18
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention relates to a method for fabricating III-V semiconductor micro-optical lenses for hybrid integration with micro-optical devices, where a micro-optical lens is formed from a semiconductor wafer by selectively etching a surface of the semiconductor wafer and a lens arm is formed from the semiconductor wafer on a surface opposite the surface by selectively etching the surface of the semiconductor wafer. The lens and lens arm are then cleaved from the substrate wafer and directly mounted to a micro-optical device. As a result of using III-V semiconductor material to form micro-optical lenses for hybrid integration to micro-optical devices of the same semiconductor material, thermal expansion stability is increased and efficient transfer of light between micro-optical lenses and micro-optical devices is achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.