Method for spray-cooling a tunable semiconductor device
US5854092A · kind A · utility
45Cited by
3References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1997 |
| Grant date | Dec 29, 1998 |
| Priority date | — |
| Expiry date | Nov 12, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The method includes providing a substrate (18) having a semiconductor die (12) thereon, the semiconductor die having a major surface (23); disposing an input region (24) an active region (32) and a conductive region (34) on the major surface, the conductive region electrically coupling the input region and the active region; providing an inductive metal region (42) in communication with the input region, the inductive metal region sized to allow real-time iterative tuning of the electronic device; and receiving a fluid by a nozzle (60), the nozzle atomizing the fluid and discharging the fluid onto the major surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.