Epoxy resin composition
US5854316A · kind A · utility
4Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 1997 |
| Grant date | Dec 29, 1998 |
| Priority date | — |
| Expiry date | Feb 26, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An epoxy resin composition composed of an epoxy resin (A), a hardener (B), and an inorganic filler (C), characterized in that the content of the inorganic filler (C) is 70-97 wt % and the inorganic filler (C) contains 0.1-50 wt % of alumina. When used to seal semiconductor devices, it exhibits good moldability and imparts to the sealed semiconductors good flame retardance, solder heat resistance, and reliability at high temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.