Thermoplastic molding compound

US5854353A · kind A · utility

Assignee

• BASF SE

Inventors

• Konrad Knoll · Mannheim, DE
• Hermann Gausepohl · Mutterstadt, DE

Key dates

• Filing date: Dec 16, 1996
• Grant date: Dec 29, 1998
• Expiry date: Dec 16, 2016

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08F297/02
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Thermoplastic molding compounds comprise as essential components PA1 A) from 10 to 100% by weight of copolymers of the monomers of the general formulae I and II ##STR1## where R.sub.1 is H or alkyl of 1-22 carbon atoms, PA2 R.sub.2 is H or alkyl of 1-22 carbon atoms, PA2 R.sub.3 is H or alkyl of 1-4 carbon atoms, PA2 a is 0, 1, 2, 3, 4 or 5, and PA2 b is 0, 1, 2, 3, 4 or 5, PA1 B) from 0 to 3000 ppm, based on the weight of component A, of compounds of the general formula I, PA1 C) from 0 to 500 ppm, based on the weight of component A, of compounds of the general formula II, PA1 D) from 0 to 90% by weight, based on the total weight of the molding compound, of polymers other than A), and PA1 E) from 0 to 50% by weight, based on the total weight of the molding compound, of additives and processing aids.