Long fin omni-directional heat sink
US5854739A · kind A · utility
9Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 1996 |
| Grant date | Dec 29, 1998 |
| Priority date | — |
| Expiry date | Feb 20, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heat sink adapted to dissipate heat from an electronic component wherein a plurality of heat dissipating perforated fins project generally outwardly from a planar base and are spaced apart by channels therebetween. The height of the perforated fins to the width of the channels is at least about 8 to 1. The perforations through the fins are such that the flow of cooling fluid through the fins generally emulates the flow through a comparable pin grid array heat sink. The fin structure is such that the fin is structurally supported against deformation, particularly during cross-cutting operations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.